Which article would most directly govern the bonding of metal enclosures and the equipment grounding conductor size?

Which article would most directly govern the bonding of metal enclosures and the equipment grounding conductor size?

• A. Article 250
• B. Article 300
• C. Article 240
• D. Article 310

Answer: (A)

Bonding metal enclosures and sizing the equipment grounding conductor are handled directly by the article that covers grounding and bonding. This article sets the rules for providing a reliable grounding path, including how the equipment grounding conductor is sized in relation to the overcurrent device and the bonding requirements for metal enclosures. The other articles address different topics—wiring methods, overcurrent protection, and conductors themselves—not the direct requirements for enclosure bonding and EGC sizing. So the article on grounding and bonding is the one that governs these aspects.

Bonding metal enclosures and sizing the equipment grounding conductor are handled directly by the article that covers grounding and bonding. This article sets the rules for providing a reliable grounding path, including how the equipment grounding conductor is sized in relation to the overcurrent device and the bonding requirements for metal enclosures. The other articles address different topics—wiring methods, overcurrent protection, and conductors themselves—not the direct requirements for enclosure bonding and EGC sizing. So the article on grounding and bonding is the one that governs these aspects.